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1. general description the uba2080(a) and uba2081 are high voltage monolithic integrated circuits made using the latch-up free silicon-on-insu lator (soi) process. the circ uit is designed for driving mosfets in a half-bridge configuration. 2. features and benefits ? latch-up free and robust half bridge driver ? output driver capability: i o(sink) = 400 ma and i o(source) = 200 ma ? maximum frequency 800 khz ? uba2080: ? outputs in phase with hin and lin inputs ? overlap protection ? uba2081: ? outputs in phase with clk input ? adjustable dead-time ? low active shutdown input 3. applications ? driver (via external mosfets) for any ki nd of load in a half-bridge configuration ? uba2080a: ? selectable between uba2080 and uba2081 functionality ? thermally enhanced package for high frequency operation. 4. ordering information uba2080; uba2080a; uba2081 half-bridge driver ic rev. 3 ? 18 june 2012 product data sheet table 1. ordering information type number package name description version uba2080p dip8 plastic dual in-line package; 8 leads sot97-1 uba2081p uba2080t so8 plastic small outline package; 8 leads sot96-1 uba2081t UBA2080AT so14 plastic small outline package; 14 leads sot108-1
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 2 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic 5. block diagram refer to figure 7 and figure 8 for detailed information on the required application components. fig 1. block diagram (uba2080 and uba2080a with select = gnd) logic sel ulvo ulvo hs driver fs sh gh v dd level shifter ls driver overlap protection r1 r2 s gnd gl aaa-001102 lin hin fig 2. block diagram (uba2080a and uba2081 with select = v dd ) logic non-overlap ulvo ulvo hs driver fs sh gh v dd sd sel v ref clk level shifter ls driver r1 r2 s gnd gl aaa-001107
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 3 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic 6. pinning information 6.1 pinning 6.2 pin description fig 3. uba2080: pin configuration dip8 and so8 package fig 4. uba2080a: pin configuration so14 package fig 5. uba2081: pin configuration dip8 and so8 package uba2080 v dd gl gnd sh lin gh hin fs aaa-001121 1 2 3 4 6 5 8 7 aaa-001134 uba2080a gnd sel gnd gnd sd/lin v dd gnd gl clk/hin gnd fs gnd gh sh 1 2 3 4 5 6 7 8 10 9 12 11 14 13 uba2081 v dd gl gnd sh sd gh clk fs aaa-001126 1 2 3 4 6 5 8 7 table 2. pin description uba2080/uba2081 dip8 and so8 symbol pin description uba2080 (dip8/so8) uba2081 (dip8/so8) v dd 1 ic supply gnd 2 ic ground and low-side driver return lin 3 - low-side driver logic input sd - 3 low active analog shutdown input and non-overlap time setting hin 4 - high-side driver logic input clk - 4 clock logic input fs 5 floating supply voltage gh 6 high-side mosfet gate sh 7 high-side mosfet source gl 8 low-side mosfet gate table 3. pin description UBA2080AT (so14) symbol pin description gnd 1, 2, 4, 9, 10, 13 ic ground and low side driver return sd /lin 3 low-side driver logic input or low active shutdown and non-overlap time setting clk/hin 5 high-side driver logic input or clock logic input fs 6 floating supply voltage sh 8 high-side mosfet source
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 4 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic 7. functional description 7.1 start-up state the ic enters the start-up state when the supply voltage on pin v dd increases. in the start-up state, the high-side power transistor is non-conducting and the low-side power transistor is switched on. the internal circuit is reset and the capacitor on the bootstrap pin fs is charged. the start-up state is defined until the value of v dd =thev dd(start) value. after which the ic switches to the oscillation state. the circuit enters the start-up state again when the voltage on pin v dd < v dd(stop) . 7.2 uba2080 oscillation state in the oscillation state, the output voltage of the gl and gh drivers depend on the logical signals hin and lin (see ta b l e 4 ). to prevent cross conduction in the half-b ridge mosfets, the combination hin = lin = 1 is not allowed. both gl and gh are low under this condition. 7.3 uba2081 osci llation state in the oscillation state, the output voltage of the gl and gh drivers depend on the logical signals clk and sd (see table 5 ). gh 7 high-side mosfet gate gl 11 low-side mosfet gate v dd 12 ic supply sel 14 select uba2080 or uba2081 functionality; only connect to gnd or v dd table 3. pin description UBA2080AT (so14) ?continued symbol pin description table 4. uba2080 logic table state hin lin gh gl start-up - - low high oscillation 0 0 low low oscillation 0 1 low high oscillation 1 0 high low oscillation 1 1 low low table 5. uba2081 logic table state clk sd gh gl start-up - - low high oscillation 0 0 low high oscillation 1 0 high low oscillation 0 1 low low oscillation 1 1 low low
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 5 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic 7.4 uba2081 non-overlap time the external resistor (r sd ) on pin sd sets the non-overlap time of the uba2081. the relationship between this resistor va lue and actual dead-time is listed in figure 6 . it is essential to add a 10 nf to 100 nf decoupling capacitor across r sd to ensure a noise immune dead-time system. 7.5 uba2081 shutdown protection when the voltage at pin sd is pulled below v ih , the internal sink drivers of the pins gl and gh are immediately enabled to switch off the external power mosfets. the shutdown comparator has a hysteresis of v hys(sd ) to avoid multiple switching. preferably, pin sd is pulled low via a collector of a transistor (see application schematic) to avoid loading of this pin (influences the non-overlap time settings) at normal operation. 7.6 uba2080 overlap protection the internal logic takes care that the gl driver and gh driver are both set to low in this situation to avoid that hin = lin = 1 causes a cross current in the external half-bridge. 7.7 uba2080a sel ect function pin sel enables the selection of either th e uba2080 or the uba2081 functionality. sel = 0 gives the uba2080 functionality. sel = v dd gives the uba2081 functionality. fig 6. non-overlap time versus sd resistor (r sd ) 0123 aaa-001135 1000 2000 3000 t no (ns) 0 r sd (m)
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 6 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic 8. limiting values [1] in accordance with the human body model (hbm): equiva lent to discharging a 100 pf capacitor through a 1.5 k series resistor. [2] in accordance with the machine model (mm): equival ent to discharging a 200 pf capacitor through a 1.5 k series resistor and a 0.75 h inductor. 9. thermal characteristics [1] in accordance with iec 60747-1. table 6. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v dd supply voltage nominal 0 15.5 v v fs voltage on pin fs v sh v sh +15.5 v v sh voltage on pin sh source high-side mosfet ? 3 +600 v t<1 s ? 14 +600 v v i(hin) input voltage on pin hin logic input for high-side driver 0 15.5 v v i(lin) input voltage on pin lin logic input for low-side driver 0 15.5 v v i(sel) input voltage on pin sel 0 15.5 v v clk voltage on pin clk logic input for output drivers 0 15.5 v v i(sd) input voltage on pin sd logic input for output drivers and analog input for non-overlap setting 015.5v sr slew rate on pin sh; repetitive ? 6+6v/ns t j junction temperature ? 40 +150 c t amb ambient temperature ? 40 +150 c t stg storage temperature ? 55 +150 c v esd electrostatic discharge voltage human body model: [1] pins fs, gh and sh - 1 kv pins v dd , hin, lin, sd, clk, sel - 2 kv machine model: [2] all pins - 250 v table 7. thermal characteristics symbol parameter conditions typ unit so8 r th(j-a) thermal resistance from junction to ambient in free air [1] 160 k/w so14 and dip8 r th(j-a) thermal resistance from junction to ambient in free air [1] 100 k/w
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 7 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic 10. characteristics table 8. characteristics t j = 25 c; all voltages are measured with respect to sgnd; v dd = 12.8 v; positive currents flow into the ic. symbol parameter conditions min typ max unit high-voltage supply i leak leakage current fs = gh = sh = 600 v - - 10 a start-up state i vdd current on pin v dd 420 520 620 a v dd(start) start supply voltage 11 12 13 v v dd(stop) stop supply voltage 8 8.5 9 v v dd(hys) hysteresis of supply voltage start-to-stop 3 3.5 4 v pin lin input v ih high-level input voltage 1.6 2.2 2.8 v v hys(lin) hysteresis voltage on pin lin - 400 - mv i i(lin) input current on pin lin - 0 1 a pin hin input v ih high-level input voltage 1.6 2.2 2.8 v v hys(hin) hysteresis voltage on pin hin - 400 - mv i i(hin) input current on pin hin - 0 1 a pin clk input v ih high-level input voltage 2.7 - - v v il low-level input voltage - - 0.8 v i i(clk) input current on pin clk - 0 1 a pin sd input v ih high-level input voltage to activate shutdown 1.6 2.2 2.8 v v hys(sd) hysteresis voltage on pin sd - 400 - mv t no non-overlap time r sd = 100 k ; typical minimum - 140 - ns r sd =3m ; typical maximum - 2.4 - s pin sel input i i(sel) input current on pin sel - 0 1 a gate drivers i o(source) output source current v fs =v vdd =12v; v sh =0v; v gh =v gl =8v -200- ma i o(sink) output sink current v fs =v vdd =12v; v sh =0v; v gh =v gl =4v -400- ma v d(bs) bootstrap diode voltage i d(bs) =20ma - 2.3 - v v uvlo undervoltage lockout voltage reset 3.6 4.2 4.8 v i fs current on pin fs v fs =v vdd =12v; v sh =0v 27 32 37 a timing t pd propagation delay uba2080; matching; c (gl) =c (gh) = 0, propagation time difference between gl and gh. -50- ns
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 8 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic 11. application information t pd(lin-gl) propagation delay from lin to gl uba2080; c (gl) =0pf - 240 - ns t pd(hin-gh) propagation delay from hin to gh uba2080; c (gh) = 0 pf - 180 - ns f max maximum frequency 800 - - khz table 8. characteristics ?continued t j = 25 c; all voltages are measured with respect to sgnd; v dd = 12.8 v; positive currents flow into the ic. symbol parameter conditions min typ max unit fig 7. typical uba2080 application remark: the capacitor connected to the sd pin ensures a noise immune dead-time. fig 8. typical uba2081 application uba2080 from c fs gh to load sh hin lin gl hv in c fs c vdd aaa-001424 v dd v dd supply gnd uba2081 input clock shutdown fs gh to load sh sd clk gl gnd hv in c fs c vdd t no aaa-001425 v dd v dd supply r sd
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 9 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic 12. package outline fig 9. package outline sot96-1 (so8) unit a max. a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 0.25 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. 1.0 0.4 sot96-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 4 5 pin 1 index 1 8 y 076e03 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.05 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.01 0.041 0.004 0.039 0.016 0 2.5 5 mm scale so8: plastic small outline package; 8 leads; body width 3.9 mm sot96-1 99-12-27 03-02-18
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 10 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic fig 10. package outline sot97-1 (dip8) references outline version european projection issue date iec jedec jeita sot97-1 99-12-27 03-02-13 unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.045 0.17 0.02 0.13 b 2 050g01 mo-001 sc-504-8 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 8 1 5 4 b e 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. pin 1 index dip8: plastic dual in-line package; 8 leads (300 mil) sot97-1
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 11 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic fig 11. package outline sot108-1 (so14) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale so14: plastic small outline package; 14 leads; body width 3.9 mm sot108-1
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 12 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic 13. revision history table 9. revision history document id release date data sheet status change notice supersedes uba2080_uba2081 v.3 20120618 product data sheet - uba2080_uba2081 v.2 modifications: ? data sheet status changed from preliminary to product. ? table 6 ? limiting values ? has been updated. uba2080_uba2081 v.2 20120426 preliminary data sheet - uba2080_uba2081 v 1.1 uba2080_uba2081 v.1.1 20111206 objective data sheet - uba2080_uba2081 v.1 uba2080_uba2081 v.1 201 11116 objective data sheet -
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 13 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic 14. legal information 14.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 14.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 14.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
uba2080_uba2081 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 18 june 2012 14 of 15 nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 14.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 15. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors uba2080; uba2080a; uba2081 half-bridge driver ic ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 18 june 2012 document identifier: uba2080_uba2081 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 16. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 4 7.1 start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 uba2080 oscillation state. . . . . . . . . . . . . . . . . 4 7.3 uba2081 oscillation state . . . . . . . . . . . . . . . . 4 7.4 uba2081 non-overlap time . . . . . . . . . . . . . . . 5 7.5 uba2081 shutdown protection . . . . . . . . . . . . . 5 7.6 uba2080 overlap protection. . . . . . . . . . . . . . . 5 7.7 uba2080a select function . . . . . . . . . . . . . . . . 5 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 thermal characteristics . . . . . . . . . . . . . . . . . . 6 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 application information. . . . . . . . . . . . . . . . . . . 8 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 14 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 14.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 14.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 15 contact information. . . . . . . . . . . . . . . . . . . . . 14 16 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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